MicDAT' 2024: 6th International Conference on Microelectronic Devices and Technologies The Ibiza Twiins Hotel Ibiza, Spain, September 25-27, 2024

About the Event

The conference is the 6^th of Series of annual International Conferences on Microelectronic Devices and Technologies (MicDAT) held in Barcelona (Spain), 2018, in Amsterdam (The Netherlands), 2019, in virtual format in 2020/2021, in Corfu (Greece), 2022 an in Funchal (Madeira Island), Portugal, 2023, organized by IFSA - non-profit, professional association, serving for academy and industry since 1999.

The MicDAT' 2024 conference is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this event.

A number of recognized experts from both: academy and industry in the field of microelectronic design will be invited to give their view in selected application areas. Featuring strong participation of industry and academia, the MicDAT' 2024 conference will provide an excellent opportunity to exchange ideas and present latest advancements in these areas.

The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.

We trust that you will find MicDAT' 2024 conference professionally rewarding and stimulating as well as enjoyable.

Submission Guidelines

All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome:

• Regular papers
• Posters
• Special sessions papers
• Keynote presentations
• Invited talks
• Industrial presentations

Papers must be prepared according to the conference proceedings template 

Posters size: A0 (21 x 29.7 cm), vertical orientation

List of Topics

• Analog, digital, mixed, and RF circuits and related design methodologies
• Analog-to-Digital Converters (ADC)
• Voltage-to-Frequency Converts (VFC)
• Frequency-to-Digital Converters (FDC)
• Time-to-Digital Converters (TDC)
• Semiconductor Devices: physics and technology
• Circuit Theory and Applications
• Active and Passive Electronic Components
• Logic, architectural, and system level synthesis
• Nonlinear circuits
• Microprocessors, microcontrollers and DSPs
• Testing, design for testability, built-in self-test
• Area, power, and thermal analysis and design
• Mixed-domain simulation and design
• Embedded systems, low-power designs
• VLSI Circuit and Systems design
• Non-von Neumann computing and related technologies and circuits
• Design and test of high complexity systems integration
• SoC, MPSoC, NoC, SIP, and NIP design and test
• Process technologies, CMOS, BJT, BiCMOS, GaAs
• 3-D integration design and analysis
• Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
• Design for Manufacturability/Technology Optimization/Yield & Quality
• Microelectronics processing and materials
• Semiconductor processing
• Modern electronics materials
• Solid-state electronics
• Quantum electronics
• Thin solid films
• Nanoprocessing, nanotechnology and nanofabrication​
• Nanoelectronics and Spintronics
• Flexible and stretchable electronics​
• MEMS, MOEMS and NEMS
• Computer-Aided Design (CAD) of Integrated Circuits
• Hardware/software co-design
• Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
• Electronic materials science and technology
• Electronics Cooling and Thermal Control
• Optoelectronics
• Organic electronic materials and devices
• Microelectronics reliability and qualification
• Assembly and Packaging

• Special Sessions:

  Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.

  Session organizers will get:

• Certificate of appreciation
• Free registration for the event

Program Committee

• Chairman:

  Prof., Dr. Sergey Y. Yurish (IFSA, Spain)

  Advisory Chairmen:

  Prof., Dr. Freddy Gabbay (TECHNION, Israel Institute of Technology, Haifa, Israel)

  Prof. Dr. Edward Hrynkievicz (Silesian University of Technology, Poland)​

  Dr. Josef Huran (Slovak Academy of Science, Slovakia)

  Industry Advisory Chairman

  Dr. Rozalia Beica (The Dow Chemical Company, USA)

  Conference and Publication Manager:

  Mrs. Tetyana Zakharchenko (IFSA Publishing, S.L., Spain)

Publication

One event - three different publications !

1) All registered abstracts will be published in the conference proceedings with the ISBN and DOI, distributed during the conference and submitted for indexing to the Web of Science and SCOPUS.

2) Authors will be invited to submit full-page extended papers to the special issues of Sensors & Transducers open access journal or in others afiliate MDPI's open access journal.

3) The limited number of full-page papers published in the journal will be selected by the Editorial Board to extend for book chapters for the open access Book Series on 'Advances in Microelectronics',Vol. 4.

Venue

The conference will be held in the Ibiza Twiins Hotel, (Balearic Islands), Spain

Contact

All questions about submissions should be emailed to seia@sensorsportal.com